BUSINESS
Automation Division
LAY-UP
  • X-Ray Drilling M/C(HR-E2M)
    Summary
    Machine processes base hole to form outter layer of MLB(Multi Layer Board) - Can be applied for Rigid and FPCB type
    Applied process
    Hot Press Process - X-Ray Drililng M/C - Router Process
    Main specification
    1) Hole Number : More than 1 Holes
    2) Drill Bit : Until Ø6mm
    3) Drilling Range : X Axis - 290~700mm, Y Axis - 0 ~610mm
    4) Spindle : Electric spindle
    5) Drill Accuracy : Under ±10~20㎛(Rotary & Linear Servo System Applied)
    Features
    1) Stability in board grabbing reduces most deviation
    2) User friendly Interface provided
    3) Brief registration procedure and saving provided for board processing
    4) Stable X-Ray Tube and Camera System Structure applied
    5) Measures for Hole Cap and Burr applied
    option
    1) Dust Collector
    2) AL-Coil Roll to Roll System for Laminate applied
    3) In Line Auto Loading System(X-Ray Aligner)
    4) Auto Unloading with sorting
    5) 4 Axis Drilling System
  • X-RAY PUNCHER
    Summary
    Machine processes base hole to form outter layer of MLB(Multi Layer Board) - Only for Laminate
    Applied process
    Hot Press Process - X-Ray Punching M/C\ - Router Process
    Main specification
    1) work size : 510mm*610mm(TBD)
    2) Punch size : Under Ø6mm
    3) Board Thickness :0.036~0.2mm
    4) Punch Type :Punch,Die Integrated Moving Type
    5) Punch Pressure type: SERVO PRESS
    6) Pressure :0~1000kg Variable
    7) Accuracy : ±10~20㎛
    Miscellaneous
    POWER:3P,220V 9.5KWA
    X-RAY TUBE: TWO / FOUR Head
    VOLTAGE-MAX.50KV
    CURRENT - MAX:1.0mA
    Leakage Rate-below 1micro Sv/H
    Air:0.6Mpa 600L/min
    Weight About 3400KG
  • HIGH FREQUENCY BONDING M/C(HBM-I08)
    Summary
    Machine to form outter layer of board patially ties inner layer of board and prepreg- Can be applied for Rigid and FPCB type
    Applied process
    Oxidation Process → Bonding Machine → Lay Up Process(Hot Press)
    Main specification
    1) Bonding No. : 4EA, 8EA(TBD)
    2) Bonding Thickness : Until 8mm
    3) Align.Type : CCD Camera
    4) Table No. : Left/Right Shuttle Type(2EA)
    5) Bonding Type : High Frequency
    6) Accuracy : ±20㎛
    7) Required Type : According to material and thickness
    Features
    1) Gripping type diminishes Scratch
    2) Increase working speed by Shuttle Table type
    3) Insure proper accuracy for high multi layer or Fine Pattern manufacturing
    4) Adoptation of stable automatic unloading type increase productivity
    option
    1) Automatic Loading System
    2) Automatic Width Control
    3) Bonding Point Change
  • BONDING M/C(HBM-02)
    Summary
    Machine to form outter layer of board patially ties inner layer of board and prepreg- Can be applied for Rigid and FPCB type
    Applied process
    Oxidation Process → Bonding Machine → Lay Up Process(Hot Press)
    Main specification
    1) Bonding No. : Over 12EA
    2) Bonding Thickness : Until 4mm
    3) Guide Pin No. : 4EA
    4) Table No. : Shuttle Type(2EA)
    5) Temperature Control : Individual Control
    6) Bonding time : According to thickness and material(Over 15 seconds)
    Features
    1) Increase working speed by Shuttle Table type
    2) Adoptation of Spring Type bonding heater diminishes defect rate
    3) Flexible Pin increases bonding accuracy
    4) Stable working available for Torque motor type
    option
    1) Free formation of Heater(Rectangle,Ellipse,Round act) and Pin Specification change available
    2) Automatic width control
    3) Touch Screen
    4) Cooler Units Available / Teflon Sheet Equip Type
  • LAY UP SYSTEM(LP-1000)
    Summary
    Equipment for LAY-UP process of MLB automatically lays up SUS plate and copper foil on carrier plate.
    Applied process
    Bonding Machine → Lay Up System → Hot Press Process
    Main specification
    1) Target : SUS Plate, Copper Foil / Carrier Plate Ect
    2) Sort type : Center
    3) Stock No. : According to Hot Press Spec
    4) Transfer type : Servo System & Gripper
    5) Carrier Transfer : Hydraulic Cylinder & Motor
    6) SUS Plate : Loader or In line(Pretreatment M/C)
    Features
    1) Handling of thin copper foil available
    2) Quick and Accurate transfer type
    3) Precise mark position with Laser Guide
    option
    1) 2 Columns LAY-UP
    2) Automatic width control(SUS Plate, Copper Foil Pad Ect)
    3) Carrier Conveyer System
    4) Automatic Lay Up System Possible